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Residual Solvents Class 2 - Mix A (2013 Rev) on Stabilwax (G16)

Residual Solvents Class 2 - Mix A (2013 Rev) on Stabilwax® (G16)

PeakstR (min)
1.Cyclohexane1.70
2.Methylcyclohexane1.79
3.trans-1,2-Dichloroethene2.08
4.Tetrahydrofuran2.08
5.Methanol2.25
6.Dichloromethane2.52
7.cis-1,2-Dichloroethene3.12
8.Acetonitrile3.31
PeakstR (min)
9.Toluene3.82
10.1,4-Dioxane4.21
11.Ethylbenzene5.76
12.p-Xylene6.02
13.m-Xylene6.24
14.Cumene7.53
15.o-Xylene8.00
16.Chlorobenzene9.59
image
GC_PH1177
ColumnStabilwax ®, 30 m, 0.32 mm ID, 0.25 µm (cat.# 10624)
SampleResidual Solvents Class 2 - Mix A (2013 Rev) (cat.# 36012)
Diluent:Water
Conc.: Per USP <467> method
Injection
Inj. Vol.:1,000 µL headspace-loop split (split ratio 50:1)
Liner:Premium 1.0 mm ID straight inlet liner (cat.# 23333.1)
Headspace-Loop
Inj. Port Temp.:140 °C
Instrument:Tekmar HT3
Inj. Time:1.0 min
Transfer Line Temp.:105 °C
Valve Oven Temp.:105 °C
Needle Temp.:80 °C
Standby flow rate:50 mL/min
Sample Temp.:80 °C
Platen temp equil. time:1.0 min
Sample Equil. Time:45 min
Mixer time:5.0 min
Mixing level:5
Mixer stabilize time:0.50 min
Vial Pressure:20 psi
Pressurize Time:5.0 min
Pressure Equilibration Time:0.20 min
Loop Pressure:10 psi
Loop Fill Time:2.0 min
Oven
Oven Temp.:50 °C (hold 20 min) to 165 °C at 6 °C/min (hold 20 min)
Carrier GasHe, constant flow
Flow Rate:2.2 mL/min
Linear Velocity:36 cm/sec @ 50 °C
DetectorFID @ 250 °C
Make-up Gas Flow Rate:45 mL/min
Make-up Gas Type:N2
Hydrogen flow:40 mL/min
Air flow:450 mL/min
Data Rate:20 Hz
InstrumentAgilent/HP6890 GC
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