OVIs by Dynamic Headspace and Gerstel MACH on Rtx-624 (G43) and Rtx-WAX (G16)

* Septum components

Oven
Columns	Rtx-624 20 m, 0.18 mm ID, 1.00 µm (cat.# 40924)
	and Rtx-WAX (G16) 20 m, 0.18 mm ID, 0.4 µm (custom)
	using IP deactivated guard column 5 m, 0.32 mm ID (cat.# 10044)
	with Universal “Y” Press-Tight connector (cat.# 20405)

Standard/Sample	Residual solvents Class 2 - mix A (cat.# 36271)
	Residual solvents Class 2 - mix B (cat.# 36272)
Diluent:	0.5 mL DI water/~0.2 g sodium sulfate in 20 mL headspace vial; components at 0.10 - 6.00 µg
Injection	headspace-trap split (split ratio 20:1)
Headspace-Trap
Instrument:	Tekmar HT3
Inj. Temp.:	220 °C
Transfer Line Temp.:	220 °C
Valve Oven Temp.:	220 °C
Standby flow rate:	50 mL/min
Trap Standby Temp:	40 °C
Trap Sweep Temp:	40 °C
Preheat Mixer:	On
Preheat Mixer Time:	2.0 min
Preheat Mixing Level:	5
Preheat Mixer Stabilize Time:	0.5 min
Sample Temp.:	80 °C
Sweep Flow Rate:	75 mL/min
Sweep Flow Time:	5.0 min
Dry Purge:	10.0 min, flow 100 mL/min @ 25 °C
Desorb Preheat Temp:	245 °C
Desorb:	1.0 min @ 250 °C
Trap Bake Temp:	260 °C
Trap Bake Time:	6.0 min
Trap Bake Flow:	450 mL/min
Oven Temp.:	250 °C
Carrier Gas	He

Detector	FID @ 250 °C
Make-up Gas Flow Rate:	45 mL/min
Instrument	Agilent 6890 with Gerstel Modular Accelerated Column Heater (MACH)
Notes	Sample preheat time: 15.00 min Flow rate: constant flow; column 1: 0.85 mL/min; column 2: 0.99 mL/min Gerstel temps.: Column 1: 50 °C (2 min) to 80 °C at 20 °C/min (1 min) to 200 °C at 40 °C/min (2 min) Column 2: 35 °C (2 min) to 60 °C at 100 °C/min (1 min) to 200 °C at 40 °C/min (2 min)

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